Mechanic IX5 Ultra Universal Preheating Platform Mobile Phone Motherboard Layered Bonding Glue Removal Dot Matrix Repair Heater
£22.38 Incl. VAT
Mechanic IX5 Ultra Universal Preheating Platform Mobile Phone Motherboard Layered Bonding Glue Removal Dot Matrix Repair Heater
✓ In Stock for Delivery: 10 Mar – 18 Mar (8–16 days)
Description
Product description
MECHANIC IX5 Ultra Universal Preheating Platform mobile phone motherboard Layering Tin Planting Glue Removal Heating Table Tool FREELY CONTROL TEMPERATURE 20-260. No Air Gun,No Solder lron. Aluminum Alloy Panel,Uniform Heating. Layering / Tinning/Laminating / Degumming. Fit All Sizes of Cell Phone Motherboards.
Key attributes
| customized support | OEM |
|---|---|
| brand name | MECHANIC |
| place of origin | Guangdong, China |
| warranty | 1 year |
| Product name | MECHANIC universal preheating platform |
| Model | 2025 ix5 ultra |
| PreheatingTemperature Range | 20~260°C |
| gross weight | 381.7g |
| package size | 152*113*72MM |
| Selling Units | Single item |
| Single package size | 18X15X10 cm |
| Single gross weight | 1.000 kg |







