XZZ 18 in 1 BGA Middle Layer Reballing Tin Stencil Planting Platform for X-14/Pro/Max Motherboard Soldering Tools
£9.44 Incl. VAT
XZZ 18 in 1 BGA Middle Layer Reballing Tin Stencil Planting Platform for X-14/Pro/Max Motherboard Soldering Tools
✓ In Stock for Delivery: 10 Mar – 24 Mar (8–22 days)
Description
XZZ 18 IN 1 BGA Middle Layer Reballing Stencil Plant Tin Platform For X-14 Pro Max Motherboard Soldering Tools Features: Stencils won’t deform under high temperature Featured material Strong Magnetic attraction Precise positioning Efficiency Improvement Unique design Durable Company Information Hycell specializes in consumer electronics such as headphones,game accessories and mobile case since 2012. Integrating R&D, design, production and sales, Hycell commits to offer high quality, high performance and fashion wireless headphone, wired headphone, wireless sports earphone, TWS headset, wired music earphone and other consumer electronics products and service to customers around the world. Our team Our sample exhibition space production process Packaging & Shipping Packing 1. Neutral package 2. Customized package according to client’s request Delivery 1. Sample, Delivery Time:1-3 Days. 2.Common goods has stock 3-5 days and 15-20 days if out of stock. 3. OEM Mass Order Or Custom Logo Order, 35-40 Days Our Services
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Key attributes
| material | Carbon steel, Chrome Vanadium Steel |
|---|---|
| application | Mobile phones |
| Model Number | XZZ |
| Origin | Mainland China |
| Name | Motherboard Repair Fixture |
| Model | BGA Middle Layer Reballing Stencil |
| Function | For X-14 Pro Max |
| Selling Units | Single item |
| Single package size | 15X10X5 cm |
| Single gross weight | 0.450 kg |







