I2C T18 PCB Pre-heating Station for X-17Pro Max CPU Chip Degumming Motherboard Layered Desoldering Platform

Description

Product description

I2C T18 PCB Pre-heating Station for X-17Pro Max CPU Chip Degumming Motherboard Layered Desoldering Platform 1. T18 PCB motherboard desoldering station, magnetic modular design, constant temperature desoldering, and explosion-tin proof. 2. LCD HD screen display, 2Gears of temp adjustment, Supports IP X to 17Pro Max motherboard separation, chip CPU glue removal, and other functions. 3. Aviation aluminum material, CNC precision processing, high-temperature resistance, and oxidation resistance. 4. Rapid heating, matched with PTC ceramic heating pieces, it can heat up to 180C in 60 seconds rapidly. 5. Module strong magnetic automatic adsorption, module replacement as you wish, simple and more convenient. 6. Put the chip on and switch to 245℃, then use a brush to remove the glue and tin residue on the chip, it can be adapted to 98%of the chips and can meet the needs of 98%of IC glue removal and desoldering on the market. 7. Only one host can support multiple modules, support Apple and Smartphone double-layer motherboard layering, fit, and repair, and can also be applied to the repair of various precision electronic and digital products. Specification 1. Model: T18 2. Name: T18 PCB motherboard desoldering station 3. Supply Voltage: AC 110V~220V 4. Minimum temperature: 180°C 5. Display: LED digital display 6. Maximum temperature: 245℃ 7. Body size: 134*116*17mm 8. Scope of use: Motherboard separation and bonding 9. Packing size: 214*143*80mm