XZZ 18 in 1 BGA Middle Layer Reballing Tin Stencil Planting Platform for X-14/Pro/Max Motherboard Soldering Tools

XZZ 18 in 1 BGA Middle Layer Reballing Tin Stencil Planting Platform for X-14/Pro/Max Motherboard Soldering Tools

£9.44 Incl. VAT

XZZ 18 in 1 BGA Middle Layer Reballing Tin Stencil Planting Platform for X-14/Pro/Max Motherboard Soldering Tools

In Stock for Delivery: 10 Mar – 24 Mar (8–22 days)

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SKU: ALI-1601234557356 Categories: , , Brand: Product Code: 1601234557356

Description

XZZ 18 IN 1 BGA Middle Layer Reballing Stencil Plant Tin Platform For X-14 Pro Max Motherboard Soldering Tools Features: Stencils won’t deform under high temperature Featured material Strong Magnetic attraction Precise positioning Efficiency Improvement Unique design Durable Company Information Hycell specializes in consumer electronics such as headphones,game accessories and mobile case since 2012. Integrating R&D, design, production and sales, Hycell commits to offer high quality, high performance and fashion wireless headphone, wired headphone, wireless sports earphone, TWS headset, wired music earphone and other consumer electronics products and service to customers around the world. Our team Our sample exhibition space production process Packaging & Shipping Packing 1. Neutral package 2. Customized package according to client’s request Delivery 1. Sample, Delivery Time:1-3 Days. 2.Common goods has stock 3-5 days and 15-20 days if out of stock. 3. OEM Mass Order Or Custom Logo Order, 35-40 Days Our Services

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Key attributes

material Carbon steel, Chrome Vanadium Steel
application Mobile phones
Model Number XZZ
Origin Mainland China
Name Motherboard Repair Fixture
Model BGA Middle Layer Reballing Stencil
Function For X-14 Pro Max
Selling Units Single item
Single package size 15X10X5 cm
Single gross weight 0.450 kg